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Multichip module production involves covering a substrate and mounted components with resin and removing substrate to expose resin surface and surfaces of components with revealed mounting lands
Multichip module production involves covering a substrate and mounted components with resin and removing substrate to expose resin surface and surfaces of components with revealed mounting lands
Production of a multichip module (MCM) involves depositing a layer of resin over a substrate and electronic components provided on the substrate, subsequently removing the substrate to exposed the resin surface and the surfaces of the components with revealed electrical mounting lands on the same level, and providing electrical connections on the resin surface. Production of a multichip module (MCM) involves: (a) positioning an assembly of components on the surface of a substrate so that the electrical mounting lands of the components are in contact with the surface of the substrate; (b) depositing a molding resin (4) on the assembly of components and on the substrate surface so as to bury the components in the resin; (c) solidifying the resin (4); (d) removing the substrate in order to expose the surface (40) of the resin (4) and the surfaces of the components having the mounting lands of the components and which are level with the resin surface (40); and (e) providing, on the surface (40) of the resin, electrical connections between the components and to one or more external elements. An Independent claim is given for a multichip module comprising a number of components buried in a resin (4), where the surfaces of the components having mounting lands are located in the same plane, and the plane comprises an assembly of electrical conductors that allow connection between the components and to external elements.
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