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ELECTRODEPOSITED COPPER FOIL WITH ITS SURFACE PREPARED, PROCESS FOR PRODUCING THE SAME AND USE THEREOF
ELECTRODEPOSITED COPPER FOIL WITH ITS SURFACE PREPARED, PROCESS FOR PRODUCING THE SAME AND USE THEREOF
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机译：电镀铜箔及其表面，用于生产和使用铜箔的过程
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摘要
A process for producing an electrodeposited copperfoil with its surface prepared, comprising the stepsof: subjecting an electrodeposited copper foil having ashiny side and a matte side whose average surfaceroughness (Rz) is in the range of 2.5 to 10 [err]m to atleast one mechanical polishing so that the averagesurface roughness (Rz) of the matte side becomes in therange of 1.5 to 3.0 [err]m; and subjecting the matte sidehaving undergone the mechanical polishing to aselective chemical polishing so that the averagesurface roughness (Rz) of the matte side becomes in therange of 0.8 to 2.5 [err]m. The invention further providesan electrodeposited copper foil with its surfaceprepared, produced by the above process, and stillfurther provides PWBs and a multilayer laminate of PWBs,produced with the use of the above electrodepositedcopper foil with its surface prepared. The mechanicalpolishing followed by chemical polishing of the matteside enables obtaining an electrodeposited copper foilwith its surface prepared, the matte side of whichexhibits excellent properties, and hence enablesobtaining PWBs and a multilayer PWBs which haveexcellent properties.
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