首页> 外国专利> METHOD OF TRANSPLANTATION WITH DIGGING AROUND ROOT FOR TRANSPLANTATION FOR IMPROVING ROOTING EFFICIENCY AND SAVING LABOR

METHOD OF TRANSPLANTATION WITH DIGGING AROUND ROOT FOR TRANSPLANTATION FOR IMPROVING ROOTING EFFICIENCY AND SAVING LABOR

机译:挖根植栽法提高植株成活率和节省劳动力

摘要

PROBLEM TO BE SOLVED: To improve rooting efficiency of transplantation and at the same time standardize works and save labor by performing 'digging around roots for transplantation', taking an adequate curing period, and then carrying out transplantation.;SOLUTION: When 'digging around roots for transplantation' is performed, the size of the root ball 12 for transplanting the tree in future is assumed, the root ball is covered with a protecting material 19 which is resistant to deformation in such a manner that it becomes the same size as assumed above, the gap between the root and the protecting material is filled with modified soil 21 or the like, and the protecting material is fixed with a binding material 47. The skin of the largest root is peeled off in a ring shape 16 at its end, but at the part where it touches the modified soil inside the covering material, the skin of the largest root is partly peeled 16 leaving the upper side of the skin unpeeled. The plant 10 to be transplanted is held in such a state that the tree is planted in a gigantic plant pot. The root ball is buried in soil together with the protecting material, the protecting material rots in future and assimilates to the peripheral soil, and thus the transplantation is completed.;COPYRIGHT: (C)2002,JPO
机译:要解决的问题:通过执行“围绕根进行挖掘”,留出足够的固化时间然后进行移植,提高移植的生根效率,同时规范工作并节省劳力。解决方案:进行“移栽根”,假定将来要移栽树木的根球12的尺寸,根球被保护材料19覆盖,该材料抗变形,使得其变成与假定的尺寸相同。如上,在根和保护材料之间的间隙中填充改性土壤21或类似物,并用粘结材料47固定保护材料。最大根的皮肤在其端部被剥开成环形16。 ,但在其接触覆盖材料内部改良土壤的部分,最大根部的皮肤被部分剥皮16,而皮肤上侧未剥皮。将要移植的植物10保持在将树种在巨大的花盆中的状态下。根球与保护材料一起埋在土壤中,保护材料将来会腐烂并吸收到周围的土壤中,从而完成了移栽。;版权所有:(C)2002,日本特许厅

著录项

  • 公开/公告号JP2002065063A

    专利类型

  • 公开/公告日2002-03-05

    原文格式PDF

  • 申请/专利权人 NISHIDA HIDEKI;

    申请/专利号JP20000306820

  • 发明设计人 NISHIDA HIDEKI;

    申请日2000-09-01

  • 分类号A01G7/00;A01G23/04;

  • 国家 JP

  • 入库时间 2022-08-22 00:54:31

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