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CONTAMINATION EVALUATING METHOD ON SUBSTRATE SURFACE, CONTAMINATION EVALUATING DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
CONTAMINATION EVALUATING METHOD ON SUBSTRATE SURFACE, CONTAMINATION EVALUATING DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
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机译：基板表面的污染评估方法，污染评估装置以及半导体装置的制造方法
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摘要
PROBLEM TO BE SOLVED: To provide a method for evaluating contamination by a molecular or cluster chemical substance adsorbed on the surface of a desirable region without damaging a semiconductor substrate having a complicated shape and the surface constituted with plural kinds of materials, and provide a device for evaluation and a manufacturing method for a semiconductor device based on contamination evaluation.;SOLUTION: Electron beams 102 irradiate the surface of a substrate 101, and substrate current induced in the substrate 101 and flowing to a ground 110 is measured with an electrode 108 and an ampere meter 109. The contamination of the substrate under measurement is evaluated based on the difference between values of substrate current produced by the irradiation of the electron beams 102 in each measuring substrate of an evaluation target. Contamination evaluation is executed to the semiconductor substrate on the way of manufacturing in the manufacturing line of the semiconductor device, and if the substrate current value does not satisfy a condition specified by a proceeding step working process, an optimum cleaning process purposing the removal of the adsorbed substances on the substrate surface is applied.;COPYRIGHT: (C)2002,JPO
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