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Thin film probe manufacturing method for testing integrated circuit, involves removing substrate from electrical conducting material after connecting track to electrical conducting material

机译：用于测试集成电路的薄膜探针的制造方法，涉及在将轨道连接至导电材料之后从导电材料中去除基板

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摘要

An electrical conducting material (250) is provided to the press circles of the substrate (200). A conductor track (252) is connected to the electric conducting material and the substrate is removed from the electric conducting material.

机译：导电材料（250）被提供到基板（200）的压圈。导体轨迹（252）连接到导电材料，并且衬底从导电材料中去除。

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公开/公告号DE10023379A1

专利类型
公开/公告日2001-03-08

原文格式PDF
申请/专利权人 CASCADE MICROTECH INC.;
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申请/专利号DE2000123379
发明设计人 GLEASON REED;BAYNE MICHAEL A.;SMITH KENNETH;
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申请日2000-05-12
分类号B81B3/00;G01R31/28;B81C1/00;G01R1/067;
国家 DE
入库时间 2022-08-22 01:09:46

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