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3 Method and Apparatus for Three Dimensional Thickness Profile Measurement of Transparent Dielectric Thin-Film by White-Light Scanning Interferometry
3 Method and Apparatus for Three Dimensional Thickness Profile Measurement of Transparent Dielectric Thin-Film by White-Light Scanning Interferometry
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机译：3用白光扫描干涉法测量透明介质薄膜的三维厚度轮廓的方法和装置
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摘要
The present invention measured thickness profile and refractive index measuring method, and relates to a recording medium, in particular by using a scanning white light interferometry semiconductor and related industries, a transparent dielectric thin film (transparent dielectric thin- with or without a pattern to the pattern produced in the film) aims to provide a thickness profile (thickness profile) the three-dimensional measuring method or to white light scanning interferometry measuring three-dimensional thickness profile measurement and the refractive index of the transparent thin-film layer with which allows to measure the refractive index and the recording medium of the have.; Also, the first step according to the present invention, there is provided a scanning white light interferometry, to obtain the interference signal to calculate the phase graph by performing a Fourier transform; A second step for calculating the mathematical model and the phase graph of the measured water therethrough; And the first and the second measurement method consisting of thickness profile, including the step of using the phase obtained in step 2 by setting the error function by measuring the shape and the thickness value to apply the optimization method to set the error function is provided .
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