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Method for measuring a thickness profile and a refractive index using white-light scanning interferometry and recording medium therefor

机译:使用白光扫描干涉法测量厚度轮廓和折射率的方法及其记录介质

摘要

A method and a recording medium for measuring three-dimensional thickness profile and refractive index of transparent dielectric thin-film with some patterns or not, which is fabricated in the semiconductor and related industrial field, using white-light scanning interferometry is provided.;A method for measuring a thickness profile using white-light scanning interferometry in optical system includes the following steps. A first step is to extracting a phase graph by acquiring an interference signal and performing Fourier transform. A second step is to extracting a mathematical phase graph through modeling of a measurement object. And a third step is to measuring a profile value and a thickness value by applying an optimization technique to an error function determined by using phase values which is acquired from said first step and said second step.
机译:提供一种使用白光扫描干涉法在半导体及相关工业领域中制造的,用于测量具有或不具有某些图案的透明电介质薄膜的三维厚度轮廓和折射率的方法和记录介质。在光学系统中使用白光扫描干涉法测量厚度轮廓的方法包括以下步骤。第一步是通过获取干扰信号并执行傅立叶变换来提取相位图。第二步是通过对测量对象进行建模来提取数学相位图。第三步骤是通过将优化技术应用于通过使用从所述第一步骤和所述第二步骤获取的相位值所确定的误差函数来测量轮廓值和厚度值。

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