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TIN, LEAD AND TIN-LEAD ALLOY PLATING BATH
TIN, LEAD AND TIN-LEAD ALLOY PLATING BATH
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机译：锡，铅和锡铅合金镀液
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摘要
PROBLEM TO BE SOLVED: To improve the appearance and solderability of an electrodeposited film by incorporating a specified additive into tin, lead or tin-lead alloy plating bath. SOLUTION: This tin, lead and tin-lead alloy plating bath contains (A) a soluble metallic salt consisting of the one among a stannous salt, a lead salt and a mixture of the stannous salt and lead salt and (B) a straight-chain aliphatic hydrocarbon compound with an ethylene oxide, propylene oxide or hydropropylene oxide group existing in a single or repeating molecule adjacent to one or both sides of a basically mono- or disulfide coupling. Since the bath contains the specified straight-chain aliphatic hydrocarbonic compound, the uniformity, denseness, color tone or solder wettability are improved in the wide pH range from acidic to weakly alkaline region.
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