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And a method of manufacturing the same reaction-sintered Si-impregnated porous SiC for semiconductor manufacturing heat treatment jig

机译:以及用于半导体制造热处理夹具的相同反应烧结的含硅多孔SiC的制造方法

摘要

PURPOSE: To obtain the subject heat-treating jig having high purity and high reliability by constituting a region from the surface of a jig to a part in the direction of fixed depth substantially composed only of SiC. ;CONSTITUTION: A material comprises Si-SiC complex containing SiC particles having at least ≥50μm particle diameter. A region from the surface of the material to 3-200μm in the direction of depth is composed of the SiC particles and SiC polycrystal which is obtained by making Si into SiC and has 3-200μm particle diameter. The material contains 25-75wt.% of SiC particles having 50-200μm particle diameter. The region from the surface of the material to 3-200μm in the direction of depth is constituted of a substantial SiC component detecting neither free silicon nor free carbon by a very small range X-ray diffraction method. The complex of Si and SiC shown by the figure comprises large particles 2 of SiC having ≥50μm particle diameter, very small particles 3 of SiC and impregnated silicon 4. A polycrystalline layer 5 of SiC made by reaction between the impregnated silicon and a CO gas is formed from the surface of the sintered material to 3-200μm in the direction of depth.;COPYRIGHT: (C)1996,JPO
机译:目的:通过构成从夹具的表面到在固定深度方向上基本上仅由SiC构成的部分的区域,来获得具有高纯度和高可靠性的主题热处理夹具。组成:一种材料包括Si-SiC配合物,该Si-SiC配合物包含具有至少≥50μm粒径的SiC颗粒。从材料的表面到深度方向上为3-200μm的区域由SiC颗粒和通过将Si制成SiC而获得的SiC多晶组成,并且具有3-200μm的粒径。该材料包含25-75wt。%的具有50-200μm粒径的SiC颗粒。从材料的表面到深度方向为3-200μm的区域由基本上SiC成分构成,该SiC成分通过极小范围的X射线衍射法既不检测游离硅也不检测游离碳。该图所示的Si和SiC的复合物包括粒径为50μm的大的SiC颗粒2,非常小的SiC颗粒3和浸渍的硅4。通过浸渍的硅与SiC之间的反应制成的SiC的多晶层5。从烧结材料的表面沿深度方向形成3-200μm的CO气体。版权所有:(C)1996,日本特许厅

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