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Process for making a crystalline solid-solution powder with low electrical resistance

机译:制备具有低电阻的结晶固溶体粉末的方法

摘要

A process for making a crystalline solid-solution powder which involves reacting at least two reactants in a plasma arc of a plasma chamber and blast-cooling the resultant product in a high velocity gas stream to form the powder. The first reactant is a molten metal alloy and the second reactant is a gas. The reaction is carried out in a plasma arc and the products rapidly cooled by a gas stream acting at the outlet opening of the plasma chamber. The crystalline solid-solution powder formed by the process has a low electrical resistivity. If an indium-tin alloy is used as the first reactant and oxygen as the second reactant, there is obtained an indium-tin-oxide (ITO) crystalline solid- solution powder which, when compacted to 40% of its theoretical density, has an electrical resistivity in the range of about 2 cm. This ITO crystalline solid-solution powder is particularly suitable for preparing an ITO target, with high electrical conductivity and thus high achievable sputtering rates.
机译:一种制备结晶固溶体粉末的方法,该方法包括使至少两种反应物在等离子室的等离子弧中反应,并在高速气流中鼓风冷却所得产物以形成粉末。第一反应物是熔融金属合金,第二反应物是气体。反应在等离子弧中进行,产物被作用在等离子室出口处的气流迅速冷却。通过该方法形成的结晶固溶体粉末具有低电阻率。如果将铟锡合金用作第一反应物,将氧气用作第二反应物,则将获得氧化铟锡(ITO)晶体固溶体粉末,当将其压实至理论密度的40%时,具有电阻率约为2厘米。该ITO结晶性固溶体粉末特别适合于制备ITO靶,其具有高电导率并因此具有高可达到的溅射速率。

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