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Three-dimensional surface structure inspection device e.g. for surface mount technology (SMT) circuit board solder application
Three-dimensional surface structure inspection device e.g. for surface mount technology (SMT) circuit board solder application
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机译：三维表面结构检查装置，例如用于表面贴装技术（SMT）电路板焊接应用
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摘要
An inspection device examines three-dimensional surface structures of mainly flat test items (3) by means of a camera (8). An optical sensor (7) is provided for carrying out three-dimensional detection of at least a part-zone of the test item surface, with the sensor (7) and the camera (8) combined in a sensor unit (6). A calibration mark (16) is fixed on the inspection device independent of the test-item (3) and enables the position of the camera (8) and the optical sensor (7) to be determined after photographing an object or after measuring the calibration mark (16).
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