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Sensor especially an acceleration, inclination, vibration or rotational speed sensor useful in automobiles, robotics, medicine, measurement and control or machine construction

机译:传感器,尤其是加速度,倾斜度,振动或转速传感器,适用于汽车,机器人,医学,测量和控制或机械结构

摘要

A sensor structure has light detectors for detecting light passage through openings in a structured semiconductor layer. A sensor structure for measuring acceleration or related parameters has a seismic mass which is structured in a semiconductor layer (1) on a substrate (2) and which is moved by force or acceleration, the combination of the semiconductor layer and the seismic mass having openings perpendicular to the plane of the acceleration. The novelty is that light detectors are provided on the substrate for detecting light which passes perpendicular to the acceleration plane through the openings. An Independent claim is also included for production of the above sensor structure. Preferred Features: The substrate is a silicon substrate and the semiconductor layer consists of single crystal silicon. Each light detector (3) is an electronic device integrated in the substrate and has a light sensitive region with an impedance which varies in accordance with the incident light. The openings form a stripe structure and have an aspect (height/width) ratio of greater than 3. The semiconductor layer is formed by wafer bonding of a second substrate. The seismic mass is designed such that the light detectors emit a maximum or minimum signal. A deflection limiting element is provided for limiting the maximum deflection of the seismic mass and comprises a bending beam which allows two-stage deflection limiting.
机译:传感器结构具有光检测器,用于检测穿过结构化的半导体层中的开口的光。用于测量加速度或相关参数的传感器结构具有地震质量,该地震质量构造在基板(2)上的半导体层(1)中并且通过力或加速度移动,该半导体层和地震质量的组合具有开口垂直于加速度平面。新颖之处在于,在基板上设置有光检测器,用于检测垂直于加速平面通过开口的光。还包括独立权利要求以生产上述传感器结构。优选特征:衬底是硅衬底,并且半导体层由单晶硅组成。每个光检测器(3)是集成在基板中的电子设备,并且具有阻抗随入射光而变化的光敏区域。开口形成条纹结构,并且具有大于3的纵横比(高度/宽度)。半导体层通过第二基板的晶片键合形成。设计地震质量,使得光探测器发出最大或最小信号。设置偏转限制元件以限制地震质量的最大偏转,并且包括允许两阶段偏转限制的弯曲梁。

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