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Bath for Etching Copper in the Printed Circuit Manufacturing Process.
Bath for Etching Copper in the Printed Circuit Manufacturing Process.
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机译：用于在印刷电路制造过程中蚀刻铜的镀液。
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摘要
A bath for etching copper in the printed circuit manufacturing process, containing sulphuric acid and hydrogen peroxide, wherein it contains sulphuric acid in the amount of 70/100 cm3/dm3, hydrogen peroxide in the amount of 70/100 cm3/dm3, and a stabiliser in the amount of 1/5 cm3/dm3, consisting of an aqueous solution of aminoacetic acid in the amount of 0.01/0.2 g/dm3 and dipyridyl in the amount of 0.001/0.02 g/dm3.
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