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Ag-Cu ALLOY POWDER, ITS PRODUCTION, AND PASTE USING THIS Ag-Cu ALLOY POWDER

机译:Ag-Cu合金粉末,其生产和使用该Ag-Cu合金粉末的糊料

摘要

PROBLEM TO BE SOLVED: To impart excellent migration resistance and oxidation resistance to an Ag-Cu alloy powder by allowing it to contain a specified ratio of Ag and Cu, controlling the average grain size to the value equal to or below a specified one and controlling the concn. of Ag in the surface to the one higher than that in the whole. ;SOLUTION: Powder of 1 to 10 μm average grain size is collected from 20 to 80 wt.% Ag-Cu alloy powder by a classifier, this powder is subjected to ultrasonic dispersion in water to sufficiently infiltrate the surface with water, and after that, only the Cu component in the surface is eluted in a bath of 1 to 10 vol% sulfuric acid. by using oxidizers such as hydrogen peroxide, bromine water and potassium chlorate, the reaction can be promoted. In this way, the Cu component in the surface is removed by 5 to 30 wt.%, and by the degree, the surface is enriched in Ag. The obtd. Ag-Cu alloy powder is used as electrically conductive paste with an organic binder such as a phenolic resin and a solvent such as cyclohexyl acetate.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:通过使Ag-Cu合金粉末包含指定比例的Ag和Cu,将平均晶粒尺寸控制为等于或小于指定比例的值,并赋予Ag-Cu合金粉末优异的耐迁移性和抗氧化性,该concn。表面的Ag比整体的Ag高。 ;解决方案:通过分级机从20至80 wt。%的Ag-Cu合金粉末中收集平均晶粒度为1至10μm的粉末,对该粉末进行超声分散,使其在水中充分浸润,然后,仅在1至10体积%的硫酸浴中洗脱表面的Cu成分。通过使用氧化剂,例如过氧化氢,溴水和氯酸钾,可以促进反应。以此方式,表面中的Cu组分被去除了5至30wt。%,并且在一定程度上,表面中富集了Ag。奥伯特。 Ag-Cu合金粉末与有机粘合剂(如酚醛树脂)和溶剂(如乙酸环己酯)一起用作导电浆料。版权所有:(C)2000,JPO

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