SOLDER ALLOY HAVING DECREASED FATIGUE RUPTURE OCCURRING ON SOLDERED JOINTS EXPOSED TO HEAT CYCLE STRESS

• 1. 回弹发生原因分析方法、回弹发生原因分析装置、回弹发生原因分析程序及记录媒体 [P] . 中国专利： CN102264486B . 2013.11.06
• 2. 回弹发生原因分析方法、回弹发生原因分析装置、回弹发生原因分析程序及记录媒体 [P] . 中国专利： CN102264486A . 2011-11-30
• 3. Lead-free solder alloy, fatigue-resistant solder materials containing the solder alloy, and combined products using the solder materials [P] . 德国专利： DE112010000752T5 . 2013-06-27

  机译： 无铅焊料合金，包含该焊料合金的抗疲劳焊料以及使用该焊料的复合产品

• 4. LEAD-FREE SOLDER ALLOY, FATIGUE-RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS [P] . IN2011MN01556A . 2012-01-13

  机译： 无铅焊料合金，含焊料合金的耐疲劳焊料和使用该焊料的接合产品

• 5. LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS [P] . 美国专利： US2011274937A1 . 2011-11-10

  机译： 无铅焊料合金，包含焊料合金的耐疲劳焊料和使用该焊料的接合产品

• 1. Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle [J] . HUANG Chun-yue, WU Zhao-hua, HUANG Hong-yan, 中国有色金属学报（英文版） . 2005,第004期
• 2. Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag [J] . ZHOU Ping, HU Bing-ting, ZHOU Jie-min, 中南大学学报（英文版） . 2009,第003期
• 3. Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling [C] . Abdullah Fahim, S M Kamrul Hasan, Jeffrey C. Suhling, IEEE Electronic Components and Technology Conference . 2020
• 4. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007
• 5. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014
• 6. Comparison between Soldering Property and Mechanical-Thermal Fatigue Property of Pb Contained Solder and Sn-Ag-Cu Series Solder Alloy. [O] . Masataka NISHIURA 2000
• 7. Microstructural Observations of the Sn-Pb Solder/Cu System and Thermal Fatigue of the Solder Joint [R] . Frear, D. R. 1987

• 1. Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag [J] . 周萍 ,胡炳亭 ,周孑民 . 中南大学学报 . 2009,第003期
• 2. FEM analysis of stress and strain and evaluation on reliability of soldered CBGA joints under thermal cycling [J] . 胡永芳 ,薛松柏 ,吴玉秀 . 中国有色金属学会会刊：英文版 . 2005,第S3期
• 3. Relative Damage Stress: Dominant Mechanical Factor for the Failure of Soldered Joints under Temperature Cycling [J] . Xin MA ,Yiyu QIAN and Hongyuan FANG National Key Laboratory of Welding Harbin institute of TechnologY Harbin 150001 China F. Yoshida Department of Mechanical Engineering Hiroshima University Higashi-Hiroshima 739 Japan . 材料科学技术：英文版 . 2001,第1期
• 4. 划伤方法研究应力作用下蒸汽发生器用800合金再钝化动力学的影响 [C] . Dahai Xia ,夏大海 ,Yu Zhu . 2018年全国腐蚀电化学及测试方法学术交流会 . -1
• 5. 焊接残余应力作用下含缺陷铝合金焊接接头疲劳寿命研究 [A] . 王鸾宇 . 2019