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CHEMICAL SOLUTIONS FOR REMOVING METAL-COMPOUND CONTAMINANTS FROM WAFERS AFTER CMP AND THE METHOD OF WAFER CLEANING
CHEMICAL SOLUTIONS FOR REMOVING METAL-COMPOUND CONTAMINANTS FROM WAFERS AFTER CMP AND THE METHOD OF WAFER CLEANING
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机译:CMP后去除硅片中金属杂质的化学溶液及硅片清洗方法
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摘要
A process and solution for cleaning Fe contaminants bound to a metallized semiconductor surface after CMP planarization. The solution comprises a pH buffered solution including hydrofluoric acid and a ligand selected from a group consisting of citrates and EDTA.
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