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Method for producing a hybridization of detector array and integrated circuit for readout

机译:产生探测器阵列和用于读出的集成电路的混合体的方法

摘要

A process for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface of the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.
机译:一种用于在一个基板上的半导体材料层中制造探测器阵列,并在单独基板上的半导体材料层中制造集成读出电路的工艺,以便为每种结构的最佳性能选择半导体材料,例如用于探测器的GaAs阵列和Si用于集成读出电路。将检测器阵列层从其衬底上剥离,层压在集成表面的金属化表面上,用网状通道蚀刻到集成电路表面,并通过通道在检测器阵列像素和集成读出电路之间提供互连。选择用于层压的粘合剂材料是化学稳定的,以提供电绝缘和热绝缘并在由半导体材料制造的两个结构之间提供应力释放,该半导体结构可以具有不同的热膨胀系数。

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