ADHESION PROMOTION IN PHOTORESIST LAMINATION AND PROCESSING

• 1. 促进异氰酸酯在聚氨酯层压粘合剂中化学反应的改性的乙烯基薄膜 [P] . 中国专利： CN104755261B . 2017.09.22
• 2. 促进异氰酸酯在聚氨酯层压粘合剂中化学反应的改性的乙烯基薄膜 [P] . 中国专利： CN104755261A . 2015-07-01
• 3. ADHESION PROMOTION IN PHOTORESIST LAMINATION AND PROCESSING [P] . CA1295169C . 1992-02-04

  机译： 光刻胶层压和加工中的粘合促进

• 4. Adhesion promotion in photoresist lamination and processing [P] . 欧洲知识产权局专利： EP0236950B1 . 1992-06-03

  机译： 促进光刻胶层压和加工中的附着力

• 5. ADHESION PROMOTION IN PHOTORESIST LAMINATION AND PROCESSING [P] . 韩国专利： KR900006040B1 . 1990-08-20

  机译： 光刻胶层压和加工中的粘合促进

• 1. Comparison of three processing methods for laminated bamboo timber production [J] . Edi Suhaimi Bakar, Muhammad Nadzim Mohd Nazip, Rogerson Anokye, 林业研究（英文版） . 2019,第001期
• 2. Nerve bundle formation during the promotion of peripheral nerve regeneration: collagen VI-neural cell adhesion molecule 1 interaction [J] . Jia-Hui Sun, Yi Yang, Jian-Long Zou, 中国神经再生研究（英文版） . 2022,第005期
• 3. ADHESION PROMOTION BY SURFACE-MODIFICATION AT THE PMMA-METAL INTERFACE FOR LIGA-TYPE PROCESSING [C] . S. S. Das, C. G. Khan Malek Microelectromechanical structures for materials research . 1998
• 4. Oxidative removal of implanted photoresists and barrier metals in semiconductor processing [D] . Govindarajan, Rajkumar 2012
• 5. Hard-Baked Photoresist as a Sacrificial Layer for Sub-180 °C Surface Micromachining Processes [O] . Hani H. Tawfik, Mohannad Y. Elsayed, Frederic Nabki, 2018
• 6. Adhesion-promoted copolymers for 193-nm photoresists without cross-linking during lithographic process. [O] . Jin-Baek Kim, Hyo-Jin Yun, Young-Gil Kwon, 2000

• 1. Influence of angiotensin blocker-Ⅰ-converting enzyme inhibitors on processes of formation of posttraumatic adhesions in murine model [J] . V.Zaporozhan ,A.Volyanska ,V.Marichereda . 中国现代医学杂志 . 2014,第015期
• 2. Experimental Design on Laminated Veneer Lumber Fiber Reinforced Composite： Processing Parameters and Its Durability [J] . Utai Meekum ,Yumatom Mingmongkol（ . 土木工程与建筑 . 2012,第008期
• 3. Plasma Enhanced Chemical Vapour Deposition （PECVD） at Atmospheric Pressure （AP） of Organosilicon Films for Adhesion Promotion on Ti15V3Cr3Sn3Al and Ti6Al4V [J] . Jana Haag1 ,Tobias Mertens1 ,Max Kolb1 . 材料科学与工程：中英文A版 . 2015,第007期
• 4. 在MEMS加工中光刻胶的应用 [C] . 邹应全 . 中国感光学会第九次会员代表大会暨2014年学术年会 . 2014
• 5. 柔性层压织物基材表面润湿与粘合性能的研究 [A] . 江红 . 2001