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Vacuum system with a secondary gas also connected to the roughing pump for a semiconductor processing chamber

机译：带有辅助气体的真空系统也连接到用于半导体处理室的粗抽泵

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摘要

This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semiconductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.

机译：半导体器件的制造方法和处理设备以及用于该处理设备的抽气设备技术领域本发明涉及一种半导体器件的制造方法和处理设备以及用于该处理设备的抽气设备。根据本发明，由于仅在无油真空泵中构成用于在半导体装置的制造工序中进行各种晶片处理的减压处理装置的排气系统，因此，有害的油污或加热时的油产生的油的碳化物成为有害物质。与使用真空油泵作为排空泵的常规减压处理设备相比，在减压处理室中不存在减压装置，并且使用这种装置的半导体器件的制造方法也没有。因此，通过使用具有这样的高度清洁的处理室的减压处理装置，能够获得高度清洁的真空状态，并且能够得到可靠性高且电特性不降低的半导体装置。

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公开/公告号US5062771A

专利类型
公开/公告日1991-11-05

原文格式PDF
申请/专利权人 HITACHI LTD.;HITACHI TOKYO ELECTRONICS CO. LTD.;
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申请/专利号US19890325910
发明设计人 ICHIRO GYOBU;AKIHIKO SATOU;SHIGEO TOMIYAMA;TAKASHI NAGAOKA;KOUZI AOKI;HIROAKI SAKAMOTO;KIMIO MURAMATSU;SHINJIROO UEDA;TADAO KUSAKA;MASAHIRO MASE;
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申请日1989-03-20
分类号F04D17/12;F04D25/00;
国家 US
入库时间 2022-08-22 05:45:39

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