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Semiconductor microchip - with flexible connectors emerging from epoxy encapsulation to suit microstrip or beam lead circuits
Semiconductor microchip - with flexible connectors emerging from epoxy encapsulation to suit microstrip or beam lead circuits
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机译：半导体微芯片-具有通过环氧树脂封装形成的柔性连接器，适合微带或束引线电路
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摘要
In the microchip, a crystalline semiconductor core has flexible conductors welded to metallic coatings on different faces of the chip and the unit is encapsulated in an insulating resin with low HF loss characteristics. Pref. the metal coatings are of noble metal and pref. the insulation is based on epoxy resins plasticized with polyamides having terminal amine gps., pref. contg. 0.1-10% mineral (silica) filler. Pref. the insulation is stoved at 350, pref. 6-200, degrees C. Esp. for encapsulation of electronic components in a casing with flexible contacts allowing incorporation/substitution into either microstrip or beam-lead hybrid hyperfrequency circuits.
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