process for chemical nickel plating of solid, electrically nichtleitenden areas and, in particular, to the manufacture of printed circuits

• 1. 化学镀镍液、化学镀镍方法以及利用该化学镀镍液制造的柔性镀镍层 [P] . 中国专利： CN105408518A . 2016-03-16
• 2. 化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺 [P] . 中国专利： CN101781758B . 2011.12.07
• 3. process for chemical nickel plating of solid, electrically nichtleitenden areas [P] . 德国专利： DE000001198643A . 1965-08-12

  机译： 固体，化学镀镍区化学镀镍的工艺

• 4. A method for the chemical nickel plating of solid, electrically non-conductive surfaces, in particular for the production of printed circuits [P] . 德国专利： DE1193764B . 1965-05-26

  机译： 一种用于固体非导电表面化学镀镍的方法，特别是用于印刷电路板生产的方法

• 5. Chemical nickel plating method for electrical circuit board manufacture has galvanically deposited nickel layer deoxidized and activated prior to chemical nickel plating [P] . 德国专利： DE19832249A1 . 2000-02-03

  机译： 用于电路板制造的化学镀镍方法是在化学镀镍之前将电沉积的镍层脱氧并活化

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• 2. Chemical inertness of UV-cured optical elastomers within the printed circuit board manufacturing process for embedded waveguide applications [C] . Kevin Kruse, Karl Walczak, Nicholas Thomas, Integrated optics: devices, materials, and technologies XVIII . 2014
• 3. Measurement and use of process capability in statistical process control activities in a printed circuit board manufacturing domain. [D] . Dogdu, Sezai. 1999
• 4. Influence of Manufacturing Parameters and Post Processing on the Electrical Conductivity of Extrusion-Based 3D Printed Nanocomposite Parts [O] . Rubén Paz, Rocío Moriche, Mario Monzón, 2020
• 5. Electroless copper plating by applying electrolysis. Application for a printed circuit board manufacturing process. [O] . Hideo HONMA, Tomoyuki FUJINAMI, Hiroaki TAKAGI 1990

• 1. Investigation of Electrical Stability of Nonwovens with Conductive Circuits Using Printed Conductive Inks [J] . A. Maarouf ,M. Chahid ,M. Ouarch . 纺织科学与技术（英文） . 2015,第2期
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• 5. 化学镀镍浸金和化学镀镍镀钯浸金表面处理工艺概述及发展趋势 [C] . XIE Meng ,谢梦 ,ZHANG Shu . 2013中日电子电路秋季大会暨秋季国际PCB技术/信息论坛 . 2013
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