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Epoxy resin curing agent, epoxy resin composition and cured product thereof

机译:环氧树脂固化剂,环氧树脂组合物及其固化产物

摘要

PROBLEM TO BE SOLVED: To provide a curing agent for an epoxy resin and an epoxy resin which are excellent in a balance between storage stability at room temperature to about 40 ° C. and curability at the time of heating and can be suitably used as a curing agent for a one-component epoxy resin composition. To provide a composition and a cured product thereof. An imidazole compound (A) and one or more compounds (B) selected from the group consisting of a fatty acid metal salt (B1), a fatty acid borate metal salt (B2) and an aluminum chelate compound (B3) are contained. An epoxy resin curing agent is used. [Selection diagram] None
机译:要解决的问题:提供环氧树脂的固化剂和环氧树脂,其在室温下储存稳定性之间的平衡优异至约40℃,并且可以适当地用作可固化物用于单组分环氧树脂组合物的固化剂。提供一种组合物和其固化产物。含有选自脂肪酸金属盐(B1),脂肪酸硼酸盐金属盐(B2)和铝螯合化合物(B3)的咪唑化合物(A)和一种或多种化合物(B)。使用环氧树脂固化剂。 [选择图]无

著录项

  • 公开/公告号JP2021031617A

    专利类型

  • 公开/公告日2021-03-01

    原文格式PDF

  • 申请/专利权人 DIC株式会社;

    申请/专利号JP20190154621

  • 发明设计人 小林 厚子;森永 邦裕;中野 宏明;

    申请日2019-08-27

  • 分类号C08G59/40;

  • 国家 JP

  • 入库时间 2022-08-24 17:25:14

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