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Silver electrolyte for the deposition of a dispersed silver layer and the surface in contact with the dispersed silver layer

机译:用于沉积分散银层的银电解质和与分散的银层接触的表面

摘要

The present invention relates to a silver electrolyte for depositing a silver layer on a substrate, comprising: potassium cyanide, potassium cyanide having a content of 10 g/L or more, at least one kind of particle refining agent having a content of 0.2 to 10 g/L, At least one dispersant having a content of 1 to 10 g/L and at least one solid component having a content of 1 to 150 g/L, wherein the particles of the solid component have an average particle size of 10 nm-100 μm (d 50 ). Moreover, contact surfaces and methods for the deposition of such contact surfaces are disclosed.
机译:本发明涉及一种用于在基材上沉积银层的银电解质,包括:氰化钾,氰化钾,含量为10g / L或更高,至少一种含量为0.2至10的颗粒精制剂G / L,至少一种含量为1至10g / L的分散剂,含量为1至150g / L的至少一种固体组分,其中固体组分的颗粒的平均粒度为10nm -100μm(d 50 )。此外,公开了接触表面和用于沉积这种接触表面的方法。

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