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INTEGRATION TECHNIQUES FOR MICROMACHINED PMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING
INTEGRATION TECHNIQUES FOR MICROMACHINED PMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING
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机译：使用热压粘合，共晶键合和焊接焊接和焊接阵列微机械用品阵列和电子的集成技术
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摘要
The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual pMUTs of pMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual pMUTs of the pMUT array is addressable.
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