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APPLICATION TECHNOLOGY FOR BUYED COMPONENTS USE OF A UV-HYDRIBLE adhesive
APPLICATION TECHNOLOGY FOR BUYED COMPONENTS USE OF A UV-HYDRIBLE adhesive
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机译：购买组件的应用技术使用紫外线乙型粘合剂
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摘要
A procedure for detecting a signal from a encapsulated test point on a device to be tested shall include the formation of a hole in a encapsulation adjacent to the test point, where the hole extends through encapsulation to the test point, the insertion of an UV-hardened conductive adhesive into the hole in such a way that: that the applied adhesive contacts the test point, using UV light from a UV light source to harden the applied adhesive, and connecting a conductive element between the hardened adhesive and a test and measurement instrument.
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