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Lead free low melting point glass composition, low melting point glass composite material including the low melting point glass composite material and low melting point glass paste, and encapsulation structure, electroelectronic component and coating component using the same
Lead free low melting point glass composition, low melting point glass composite material including the low melting point glass composite material and low melting point glass paste, and encapsulation structure, electroelectronic component and coating component using the same
PROBLEM TO BE SOLVED: To provide a lead-free low melting point glass composition which can be sealed and adhered near the melting point of tin (232 ° C.) and has high adhesiveness and adhesion. A lead-free low melting point glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, which satisfies the following two relational expressions (1) and (2) in terms of oxide. [Ag 2 O] ≧ [Te O 2 ] ≧ [V 2 O 5 ] ≧ [Li 2 O]… (1) 2 [V 2 O 5 ] ≧ [Ag 2 O] + [Li 2 O] ≧ 40… (2) (In the formula, [X] represents the content of component X, and its unit is "mol%". The same shall apply hereinafter.) [Selection diagram] Fig. 1
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机译：要解决的问题：提供一种无铅低熔点玻璃组合物，其可以密封并粘附在锡（232℃）的熔点附近并具有高粘附性和粘附性。含有氧化钒，氧化碲，氧化银和氧化锂的无铅低熔点玻璃组合物，其在氧化物方面满足以下两个关系表达式（1）和（2）。 [ag 2 o]≧[te o 2 ]≧[v 2 O 5 ]≧[li <亚> 2 O] ...（1）2 [V 2 O 5 ]≧[ag 2 o] + [li 2 O]≧40 ...（2）（在式中，[x]表示组分x的含量，其单位是“mol％”。在下文中相同。）[选择图] 图。1
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