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Reflow furnace monitoring device and reflow furnace monitoring method and reflow system

机译:回流炉监测装置和回流炉监测方法和回流系统

摘要

PROBLEM TO BE SOLVED: To provide a reflow furnace monitoring device capable of grasping an accumulation flux amount during operation of a reflow furnace.SOLUTION: A reflow furnace monitoring device has a flux content storage section, a print solder paste amount acquisition section, a print flux amount calculation section and an accumulation flux amount calculation section. The flux content storage section stores a flux content of a solder that is to be subjected to reflow by a reflow furnace. The print solder paste amount acquisition section acquires a print solder paste amount printed on a workpiece before reflow. The print flux amount calculation section calculates a print flux amount printed on the workpiece based on the flux content and the print solder paste amount. The accumulation flux amount calculation section calculates the accumulation flux amount accumulated in the reflow furnace from a predetermined initial state based on specification of the reflow furnace, the print flux amount and the reflow execution history.SELECTED DRAWING: Figure 1
机译:要解决的问题:提供一种热回流炉监测装置,能够在回流炉的运行过程中掌握累积助焊量。溶液:回流炉监测装置具有助焊剂含量存储部分,印刷焊料粘贴量采集部分,印刷品助焊量计算部分和累积助焊量计算部分。磁通含量存储部分存储焊料的焊剂含量,该焊料将被回流炉进行回流。印刷焊膏额采集部分在回流之前获取印刷在工件上的印刷焊膏量。打印焊剂量计算部分根据助焊剂含量和印刷焊膏量计算印刷在工件上的打印焊剂量。基于回流炉的规格,打印焊剂量和回流执行历史,累积磁通量计算部分从预定的初始状态计算回流炉中累积的累积磁通量。选择绘图:图1

著录项

  • 公开/公告号JP6891420B2

    专利类型

  • 公开/公告日2021-06-18

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP20160151388

  • 发明设计人 曲谷 光正;

    申请日2016-08-01

  • 分类号B23K3/08;H05K3/34;B23K1/008;B23K1;B23K3/06;B23K101/42;

  • 国家 JP

  • 入库时间 2022-08-24 19:33:37

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