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POLICE ISSUES FOR WATER POLICY PREPARATION AND MANUFACTURING PROCEDURES
POLICE ISSUES FOR WATER POLICY PREPARATION AND MANUFACTURING PROCEDURES
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机译：水政政策制备和制造程序的警察问题
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摘要
The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower part of the front surface part, and a plurality of grid grooves passing through the front surface part and the rear surface part; a lower pad, which is arranged on the lower part of the upper pad and can be attached to a surface plate; and an adhesion part positioned between the upper pad and the lower pad to couple the upper pad with the lower pad.
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