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Switch-Mode Based Interposer Enabling Self-Testing Of An MCM Without Known Good Die
Switch-Mode Based Interposer Enabling Self-Testing Of An MCM Without Known Good Die
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机译：基于切换模式的插入器，可以在没有已知的好模具的情况下进行MCM的自检
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摘要
A Switching Mode Interposer (SMI) arrangement for boundary-scan testing of a Multi-Chip Module having a System-On-Chip, a Microprocessor Control Unit, and multiple chiplets-based devices including central processing units, graphical processing units, and/or memory devices disposed on a two-tiered interposer-substrate system. The SMI includes (a) a twin Test Access Port connected to a JTAG controller and configured to transmit test data in one direction (TAP-X) and an opposite direction (TAP-Y) along an Inter-Integrated Circuit (I2C) bus connected with the SOC, the MCU and the multiple devices, the test data being formatted according to IEEE 1149.1 or IEEE 1149.7 standard; and (b) a Mux/DeMux switch connected to the twin TAP and the I2C bus and responsive to the SOC or the MCU for selective switching of the test data along either the TAP-X or TAP-Y direction to a predetermined port associated with one of the multiple devices.
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