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FLEET MATCHING OF SEMICONDUCTOR METROLOGY TOOLS WITHOUT DEDICATED QUALITY CONTROL WAFERS

机译：没有专用质量控制晶片的半导体计量工具的舰队匹配

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摘要

Methods and systems for calibrating metrology tool offset values to match measurement results across a fleet of metrology tools are presented herein. The calibration of offset values is based on measurements of inline, production wafers and does not require the use of specially fabricated and characterized quality control (QC) wafers. In this manner, the entire process flow to calibrate metrology tool offset values is automated and fully integrated within a high volume semiconductor fabrication process flow. In a further aspect, the implementation of a new offset value is regulated by one or more predetermined control limit values. In another further aspect, the measured values of a parameter of interest are adjusted to compensate for the effects of measurement time on the wafer under measurement.

机译：本文介绍了用于校准计量工具偏移值以匹配计量工具队串的测量结果的方法和系统。偏移值的校准是基于内联，生产晶片的测量，并且不需要使用专用制造和特征的质量控制（QC）晶片。以这种方式，以校准计量刀具偏移值的整个过程流程是自动化的，并完全集成在高容量半导体制造过程流程中。在另一方面，新偏移值的实现由一个或多个预定控制限制值调节。在另一方面，调整感兴趣参数的测量值以补偿测量下晶片上的测量时间的影响。

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公开/公告号WO2021242655A1

专利类型
公开/公告日2021-12-02

原文格式PDF
申请/专利权人 KLA CORPORATION;
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申请/专利号WO2021US33806
发明设计人 WU SONG;ZHAN TIANRONG;LEE LIE-QUAN;
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申请日2021-05-24
分类号G01N21/95;G01N21/93;G01N21/88;G01N21/956;G01B11/06;H01L21/66;H01L21/67;
国家 US
入库时间 2022-08-24 22:36:30

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