首页> 外国专利> A method of polishing a semiconductor substrate that adjusts for pad pad variations (a cross reference of the related application) claims the priority of U. S. provisional application 62 / 729134, filed September 10, 2018.The disclosure of the U. S. provisional patent application is hereby incorporated herein by reference for all relevance and consistency.

A method of polishing a semiconductor substrate that adjusts for pad pad variations (a cross reference of the related application) claims the priority of U. S. provisional application 62 / 729134, filed September 10, 2018.The disclosure of the U. S. provisional patent application is hereby incorporated herein by reference for all relevance and consistency.

机译:一种抛光半导体衬底的方法,该半导体衬底调整用于垫垫的变化(相关应用的交叉参考)要求2018年9月10日提交的美国临时应用62/729134的优先级。美国临时专利申请的公开内容结合于此 这里参考所有相关性和一致性。

摘要

Disclosed is a polishing method of a semiconductor substrate with adjusting a finishing polishing sequence based on pad pad variations of a polishing pad.Diagram
机译:公开了一种半导体衬底的抛光方法,其基于抛光垫的垫垫变化调节精加工抛光序列.Diagram

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