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Metrology apparatus and method based on diffraction using oblique illumination, and method for manufacturing semiconductor device using the metrology method
Metrology apparatus and method based on diffraction using oblique illumination, and method for manufacturing semiconductor device using the metrology method
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机译：基于倾斜照明的基于衍射的计量装置和方法，以及使用计量法制造半导体器件的方法
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摘要
The technical idea of the present invention is a diffraction-based measuring apparatus and method having high measurement sensitivity that can precisely perform measurement on a semiconductor device and improve responsiveness in a semiconductor process, and a semiconductor device using the method A manufacturing method is provided. The diffraction substrate measuring apparatus includes: a light source for generating and outputting broadband light; a stage on which a measurement target is disposed; a reflection optical system that irradiates the light to the measurement target through reflection, and injects the light to the measurement target at an acute inclination angle; a detector that detects the diffracted light reflected from the measurement target and diffracted; and a measuring and analyzing unit that measures a 3D pupil matrix with respect to the diffracted light and analyzes the measurement target based on the 3D pupil matrix.
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