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NOVEL CONNECTOR DESIGNS FOR PHOTONICS PACKAGING INTEGRATION
NOVEL CONNECTOR DESIGNS FOR PHOTONICS PACKAGING INTEGRATION
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机译：小说连接器设计光子学包装集成
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摘要
Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a package substrate, and a compute die over the package substrate. In an embodiment, a photonics die is also over the package substrate, and the photonics die overhangs an edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the photonics die, and a fiber connector is coupled to the photonics die. In an embodiment, the fiber connector is attached to the IHS
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