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Fan out package-on-package with adhesive die attach
Fan out package-on-package with adhesive die attach
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机译：扇出package-on-package胶模附加
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摘要
Fan Out Package-On-Package (PoP) assemblies in which a second chip is adhered to a non-active side of a first chip. An active side of the first chip embedded in a first package material may be electrically coupled through one or more redistribution layers that fan out to package interconnects on a first side of the POP. A second chip may be adhered, with a second package material, to the non-active side of the first chip. An active side of the second chip may be electrically coupled to the package interconnects through a via structure extending through the first package material. Second interconnects between the second chip, or a package thereof, may contact the via structure. Use of the second package material as an adhesive may improve positional stability of the second chip to facilitate wafer-level assembly techniques.
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