ELECTROCHEMICAL PROCESS FOR SILICON TIPS FABRICATION

机译：硅尖端制造的电化学过程

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

This work presents the results obtained for silicon microtips fabrication of pyramidal and conical shape. The tips are prepared using processes combination that applies porous silicon (PS) as sacrificial layer previously masked by hydrogen ion implantation (H~+ I.I.) and adequate thermal annealing. The shape of the tips is dependent on the mask geometry used by blocking anodization current where PS is not desired. After selective dissolution of PS with potassium hydroxide (KOH) at room temperature, tips are formed with height of 45 μm and 2-5 μm top diameter in square geometry or less than 0.1 micron with circular geometry.

机译：这项工作提出了金字塔形和圆锥形的硅微尖制造获得的结果。使用工艺组合制备尖端，该工艺组合将多孔硅（PS）用作牺牲层，该牺牲层先前已通过氢离子注入（H ++ I.I.）和适当的热退火掩蔽。尖端的形状取决于在不需要PS的情况下阻止阳极氧化电流所使用的掩模几何形状。在室温下用氢氧化钾（KOH）选择性溶解PS后，形成的尖端直径为45μm，顶部直径为2-5μm（正方形几何形状）或小于0.1微米（圆形几何形状）。

著录项

来源
《18th Symposium on Microelectronics Technology and Devices; 16th Symposium on Integrated Circuits and System Design; Sep 8-11, 2003; Sao Paulo, Brazil》|2003年|p.445-452|共8页
会议地点 Sao Paulo(BR);Sao Paulo(BR);Sao Paulo(BR);Sao Paulo(BR)
作者
Michel O.S. Dantas; Elisabete Galeazzo; Henrique E. M. Peres; F. Javier Ramirez-Fernandez;
展开▼
作者单位

Sensores Integraveis e Microssistemas (SIM) Group, Laboratorio de Microeletronica, Departamento de Engenharia de Sistemas Eletronicos (PSI), Escola Politecnica -Universidade de Sao Paulo Av. Prof. Luciano Gualberto, trav. 3, n° 158, CEP 05508-900, Sao;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词

相似文献

外文文献
中文文献
专利

1. A thick silicon dioxide fabrication process based on electrochemical trenching of silicon [J] . Barillaro G., Diligenti A., Nannini A., Sensors and Actuators, A. Physical . 2003,第3期

机译：基于硅电化学开槽的厚二氧化硅制造工艺
2. MEMS based electrochemical process for fabrication of laminated micro-inductors on silicon [J] . Anthony Ricky, Mathuna Cian O, Rohan James F. Microelectronic Engineering . 2016,第Apra期

机译：基于MEMS的电化学方法，用于在硅上制造叠层微电感器
3. Fabrication and Electrochemical Properties of Sheet-Shape Si Structure from Chamfering Process of Silicon Wafer [J] . Jian-Tao Wang, Yao Wang, Jin Li, Advanced Science, Engineering and Medicine . 2015,第6期

机译：硅片倒角工艺制备片状Si结构及其电化学性能
4. A new fabrication process of silicon nanotips: NERCOM [C] . Francis E. Tay, Ciprian Iliescu, Guolin Xu, Conference on BioMEMS and Nanotechnology . 2006

机译：硅纳米型的新制造过程：Nercom
5. Fabrication of Tungsten Tips Suitable for Scanning Probe Microscopy by Electrochemical Etching Methods [D] . Basnet, Gobind 2013

机译：电化学刻蚀法制备适用于扫描探针显微镜的钨棒
6. Integration of sharp silicon nitride tips into high-speed SU8 cantilevers in a batch fabrication process [O] . Nahid Hosseini, Matthias Neuenschwander, Oliver Peric, 2019

机译：在分批制造过程中将尖锐的氮化硅尖端集成到高速SU8悬臂中
7. TEM-Assisted Fabrication of Sub-10 nm Scanning Electrochemical Microscopy Tips [O] . Xiang Wang, Lili Han, Huolin Xin, 2019

机译：TEM辅助制备SUB-10 NM扫描电化学显微镜尖端

ELECTROCHEMICAL PROCESS FOR SILICON TIPS FABRICATION

摘要

著录项

相似文献

相关主题

期刊订阅