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首页> 外文会议>2011 International conference on semiconductor technology for ultra large scale integrated circuits and thin film transistors (ULSIC vs. TFT) >Flexible Thin Film Transistor Arrays as an Enabling Platform Technology: Opportunities and Challenges
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Flexible Thin Film Transistor Arrays as an Enabling Platform Technology: Opportunities and Challenges

机译：柔性薄膜晶体管阵列作为支持平台技术：机遇与挑战

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摘要

Significant advances in large-area flexible electronics over the last decade have created a tremendous opportunity for revolutionary transformational engineered products and systems with unique and desirable form, fit and function. In these "Flexible Systems", materials and nano-, micro-, and macro-scale devices are integrated to produce valuable multi-functional products that are characteristically thin, lightweight, flexible, conformable, and ultra-rugged for use under challenging conditions. The practical opportunities seem limitless: one can envision new dual-use technologies that can be deployed to address critical needs in a diverse application space from health sciences to information and decision technology, security and emergency response, transportation, energy and the environment. Before this compelling future is realized, however, major advances in three critical areas must be achieved: (ⅰ) design and integration; (ⅱ) flex-compatible materials, structures and devices; and (ⅲ) scaleable and sustainable manufacturing processes.
机译：在过去的十年中，大面积柔性电子技术的重大进步为具有独特且理想的形式，装配和功能的革命性改造工程产品和系统创造了巨大的机会。在这些“柔性系统”中，材料和纳米级，微米级和宏观级设备集成在一起，以生产出有价值的多功能产品，这些产品具有超薄，轻巧，灵活，舒适和超坚固的特点，可在严苛的条件下使用。实际的机会似乎是无限的：人们可以设想新的双重用途技术，可以将其部署为满足从健康科学到信息和决策技术，安全和紧急响应，运输，能源和环境等多种应用领域中的关键需求。但是，在实现这个引人注目的未来之前，必须在三个关键领域取得重大进展：（ⅰ）设计和集成； （ⅱ）柔韧性兼容的材料，结构和装置； （ⅲ）可扩展和可持续的制造过程。

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