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首页> 外文会议>2014 8th International Conference on Integrated Power Systems >3D Packaging for vertical power devices
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3D Packaging for vertical power devices

机译：垂直功率设备的3D包装

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This paper presents recent advances and breakthroughs of a commutation cell true 3D packaging solution with vertical power devices. This hybrid approach combines both wafer level and module level interconnection and assembly leading to an efficient 3D package. It can be used for regular inverters or to simplify the implementation of interleaved power converters. Direct copper bonding technology is used for the active power devices interconnection; vertical power devices are bonded at wafer level to a metallic substrate. The 3D assembly is carried out at module level based on the interconnection of matrices of low side and high side vertical power devices. As a result, the 3D integration of the active parts for power converters is optimized to the highest possible level regarding EMI levels and increased switching speed capabilities. Key challenges on design, fabrication and implementation are presented, and the first prototypes based on four switching cells of vertical 500V power diodes and MOSFETs are introduced.
机译：本文介绍了具有垂直功率器件的换向单元真正3D封装解决方案的最新进展和突破。这种混合方法结合了晶圆级和模块级的互连以及组装，从而实现了高效的3D封装。它可用于常规逆变器或简化交错式电源转换器的实现。直接铜焊技术用于有源功率器件的互连；垂直功率器件在晶圆级结合到金属基板上。基于低端和高端垂直功率器件矩阵的互连，在模块级别执行3D组装。结果，就EMI级别和提高的开关速度能力而言，功率转换器有源部件的3D集成已优化到尽可能高的水平。介绍了设计，制造和实现方面的主要挑战，并介绍了基于四个垂直500V功率二极管和MOSFET的开关单元的首个原型。

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