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首页> 外文会议>2017 IEEE Asia Pacific Microwave Conference >THz MEMS — Micromachining enabling new solutions at millimeter and submillimeter-wave frequencies (invited paper)
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THz MEMS — Micromachining enabling new solutions at millimeter and submillimeter-wave frequencies (invited paper)

机译：太赫兹MEMS —微加工实现了毫米波和亚毫米波频率下的新解决方案（特邀论文）

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Since RF MEMS switches appeared more than 20 years ago, micromachining and micromechanics have been receiving large attention for enabling near-ideal microwave devices. MEMS switches and MEMS-switch based circuits have been through different development stages and are currently proving themselves commercially, among others for mobile-phone antenna-tuner switched-capacitor banks. However, micromachining can do much more than just two-dimensional MEMS switches for planar transmission-line technology: Three-dimensional, deep-silicon micromachining allows for new microwave devices with unprecedented performance, and has the potential to become an enabling technology for volume-manufacturable, reconfigurable submillimeter-wave and THz systems. This paper provides an overview of 3D silicon micromachining capability, and recent achievements of innovative microwave devices and systems enabled by micromachining high up into the THz spectrum are given, including the first MEMS-reconfigurable submillimeter-wave devices. Highlights of devices presented are a 3.3 bit MEMS phase shifter and a low-insertion loss / high-isolation MEMS waveguide switch operating at 500-750 GHz, and a micromachined technology for multi-pole, multi-transmission zero filers which enables multi-mode resonators with Q factors of 800 at 270 GHz. Furthermore, a technology is shown for very low loss micromachined waveguides with only 0.02 dB/mm loss at 200-300 GHz, which has enabled ultra-low loss waveguide components such as couplers and power combiners/splitters.
机译：自20年前RF MEMS开关问世以来，微加工和微机械技术已成为实现近乎理想的微波设备而备受关注。 MEMS开关和基于MEMS开关的电路已经经历了不同的发展阶段，目前正在商业上证明自己，尤其是用于移动电话天线调谐器的开关电容器组。但是，对于平面传输线技术，微机械加工不仅可以实现二维MEMS开关的作用：三维深硅微机械加工可以使新型微波设备具有空前的性能，并且有可能成为实现量产的使能技术。可制造，可重构的亚毫米波和太赫兹系统。本文概述了3D硅微加工能力，并给出了通过对高达THz频谱进行微加工而实现的创新微波设备和系统的最新成果，其中包括第一批MEMS可重配置的亚毫米波设备。所展示器件的亮点是工作在500-750 GHz的3.3位MEMS移相器和低插入损耗/高隔离度MEMS波导开关，以及用于多极，多传输零滤波器的微加工技术，该技术可实现多模Q因子在270 GHz时为800的谐振器。此外，显示了一种用于极低损耗微加工波导的技术，在200-300 GHz时损耗仅为0.02 dB / mm，这使超低损耗波导组件（例如耦合器和功率合成器/分离器）成为可能。

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