首页> 外文会议>22nd Annual Semiconductor Pure Water and Chemicals Conference Feb 17-19, 2003 Santa Clara, CA >Purification of Wet Etch and Cleaning Chemicals and DI Rinse water Using High Performance Membrane Purifiers
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Purification of Wet Etch and Cleaning Chemicals and DI Rinse water Using High Performance Membrane Purifiers

机译:使用高性能膜净化器净化湿法腐蚀和清洁化学品以及去离子水

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The Front-End-Of-the-Line (FEOL) and Back-End-Of-the-Line (BEOL) wet-chemical cleaning processes are critical to the fabrication of semiconductor devices. Maximizing the purity of chemicals used in wet cleans is a prerequisite for maintaining and improving chip yield as linewidths continue to shrink. The incoming and in-process purity of chemicals used in wet cleaning greatly impact the surface contamination of wafers. While the incoming ultrapure chemicals have reduced the ion levels, exposure to metallics has persisted during wet processing. One effective way of minimizing ionic contamination is to continuously purify the chemicals in use. In this approach the metallic ions are removed by binding them to the complexing agents immobilized on membrane filters that can be plumbed in-line in the wet tools. Mykrolis has developed technologies and devices for POU (point of use) purification of DI water, dilute chemicals and organic solvents. The purifiers are made of high-binding-constant membranes (containing sulfonic acid or chelating groups) that remove ions continuously from process chemicals either in a once through or in a recirculation flow mode. The in-line purifiers offer the advantages (of consistent low ionic levels in the bath and extended bath life) over the other methods of maintaining ionic purity including spiking the baths with chelators, intermittent off-line purification or periodic replacement with new batches of ultrapure chemicals. This paper describes the design and operation of the purification systems and explains how the new membrane based purifiers reduce and control metallic ion levels and particles in chemicals either in once-through flow or recirculation baths. Experimental data from in-house testing and customer evaluations will be presented.
机译:生产线前端(FEOL)和生产线后端(BEOL)湿化学清洗工艺对于半导体器件的制造至关重要。随着线宽的不断缩小,使湿法清洁中使用的化学药品的纯度最大化是维持和提高芯片产量的前提条件。湿法清洁中使用的化学药品的进料和加工纯度极大地影响了晶圆的表面污染。尽管传入的超纯化学物质降低了离子含量,但在湿法处理过程中仍持续暴露于金属中。减少离子污染的一种有效方法是连续纯化使用中的化学物质。在这种方法中,金属离子通过将它们与固定在膜过滤器上的络合剂结合而除去,该络合剂可以在线插入湿工具中。 Mykrolis已经开发了用于去离子水,稀有化学品和有机溶剂的POU(使用点)净化的技术和设备。净化器由高结合常数的膜(含有磺酸或螯合基团)制成,该膜以一次通过或循环流动的方式从工艺化学品中连续去除离子。与其他保持离子纯度的方法相比,在线纯化器具有(恒定的低离子水平和延长的浴寿命)优势,包括保持螯合剂的浓度,间歇性离线纯化或定期更换新批次的超纯离子,从而保持离子纯度。化学药品。本文介绍了净化系统的设计和操作,并说明了新型的基于膜的净化器如何在一次通过式流通池或再循环池中降低和控制化学物质中的金属离子含量和颗粒。将提供来自内部测试和客户评估的实验数据。

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