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Second Bond Stitch Width Model as a Trend Solution for Lead Width Reduction

机译:第二键缝宽度模型作为减小引线宽度的趋势解决方案

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A well known trend in the semiconductor industry is miniaturization while continuously increasingrnthe number of Input Output (IO) connections. This trend introduces new Wire bonding (WB) challenges in thernsecond bond arena, known as the second bond stitch width. As the stitch width scale gets closer to the leadrnwidth, the need to accurately predict the second bond width becomes crucial. In order to answer this new need arnJMP (ver.7.0) model for second bond stitch width in correlation to the capillary dimensions and Wire Diameterrn(WD) is introduced. Different designs with changing geometries were optimized, bonded, and measured forrntheir stitch width responses. Geometries such as: Hole (H), Chamfer Diameter (CD), Tip size (Tip), Face Anglern(FA), Outer Radius (OR) and WD are part of the tested matrix. A verification test was conducted and customrncapillary designs were produced based on a numerical formulation from the model in order to receive a specificrnstitch width. These capillary designs were bonded and measured in order to verify the credibility of the stitchrnwidth model. An important observation out of few interesting results showed, that the main contributorsrncontrolling the second bond stitch width are the WD and Tip. Additionally a stitch width formulation as arnfunction of the main capillary geometries and WD is introduced.
机译:半导体行业的一个众所周知的趋势是小型化,同时不断增加输入输出(IO)连接的数量。这种趋势在第二键合领域引入了新的引线键合(WB)挑战,称为第二键合针迹宽度。随着针脚宽度比例越来越接近引线宽度,准确预测第二个键合宽度的需求变得至关重要。为了满足这一新的需求,引入了与毛细尺寸相关的第二键合针迹宽度的arnJMP(ver.7.0)模型,并引入了线径(WD)。优化,粘合和测量其针迹宽度响应的具有变化几何形状的不同设计。诸如:孔(H),倒角直径(CD),刀尖尺寸(Tip),端面角度(FA),外半径(OR)和WD等几何形状均属于测试矩阵。进行了验证测试,并根据该模型的数值公式生成了定制的毛细血管设计,以便获得特定的针迹宽度。对这些毛细管设计进行粘合和测量,以验证缝线宽度模型的可信度。从一些有趣的结果中可以看出,一个重要的观察结果表明,控制第二键合针迹宽度的主要因素是WD和Tip。另外,介绍了一种针迹宽度公式,该公式作为主要毛细管几何形状和WD的函数。

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