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首页> 外文会议>42nd international symposium on microelectronics (IMAPS 2009) >Microspring Characterization and Flip Chip Assembly Reliability
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Microspring Characterization and Flip Chip Assembly Reliability

机译：微弹簧特性和倒装芯片组装可靠性

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Electronics packaging based on stress-engineered spring interconnects have the potential to enable integrated ICrntesting, fine-pitch, and compliance not readily available with other technologies. We describe new spring contactsrnwhich simultaneously achieve low resistance (<100 mohm) and high compliance (>30 micron) in dense twodimensionalrnarrays (180 × 180 micron pitch). Mechanical characterization show individual springs operate atrn～0.015 gm force. Electrical measurements and simulations imply the interface contact resistance contribution to arnsingle contact resistance is < 40 mohms. Daisy chain test die consisting of 2844 contacts are assembled into fliprnchip packages with 100% yield. Thermocycle and humidity testing suggest packages with or without underfill canrnhave stable resistance values and no glitches through over 1000 thermocycles or 6000 hrs of humidity. This workrnsuggests that integrated testing and packaging can be performed with the springs, enabling new capabilities forrnmarkets such as multi-chip modules.
机译：基于应力工程弹簧互连的电子封装具有实现集成化IC测试，细间距和合规性的潜力，而其他技术尚不具备此功能。我们描述了新的弹簧触头，它在密集的二维阵列（180×180微米间距）中同时实现了低电阻（<100 mohm）和高柔顺性（> 30微米）。力学性能表明，单个弹簧的工作压力为0.015 gm。电气测量和仿真表明，界面接触电阻对单个接触电阻的贡献小于40欧姆。由2844个触点组成的菊花链测试管芯以100％的良率组装到倒装芯片封装中。热循环和湿度测试表明，带或不带底部填充的包装都可以具有稳定的电阻值，并且在超过1000个热循环或6000小时的湿度下不会出现毛刺。这项工作表明可以通过弹簧执行集成测试和封装，从而为诸如多芯片模块之类的市场提供新功能。

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