Reliability evaluation of lead-free solders for automotive applications

机译：汽车应用无铅焊料的可靠性评估

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Thermal shock and thermal cycle tests in therntemperature range from -40 ℃ to +150 ℃ was performedrnto understand the joint reliability of Sn3.5Ag, Sn0.7Curnand Sn5.0Sb. For the thermal tests, the solder balls of thernBGA test chips were fabricated using the materials. Thernthe chips are assembled to a daisy chain PCB. Thermalrnshock tests as well as thermal cycle tests were performed,rnand the resistance of the solder joints was monitoredrnduring the test. To analyze the failure, microstructure withrnrespect to IMCs morphologies and thickness was analyzedrnand compared. The shear strength was also measuredrndepending on the thermal cycles. A preliminary stressrnanalyses was also conducted by numerical simulation. Itrnwas found that Sn0.7Cu exhibited superior mechanicalrnproperties among the investigated solder materials in thernpresent test method.

机译：为了了解Sn3.5Ag，Sn0.7Curn和Sn5.0Sb的结合可靠性，在-40℃至+ 150℃的温度范围内进行了热冲击和热循环试验。对于热测试，使用这些材料制造了rnBGA测试芯片的焊球。然后将芯片组装到菊花链PCB上。进行了热冲击测试和热循环测试，并在测试过程中监测了焊点的电阻。为了分析失效，分析并比较了与IMC的形态和厚度有关的微观结构。还根据热循环测量了剪切强度。初步的应力分析也通过数值模拟进行。结果发现，在目前的测试方法中，Sn0.7Cu表现出优异的机械性能。

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来源
《42nd international symposium on microelectronics (IMAPS 2009)》|2009年|p.190-194|共5页
会议地点 San Jose CA(US);San Jose CA(US)
作者
Y.K. Sa; Yeong K. Kim; Junghwan Bang; Junki Kim; Sehoon Yoo; Changwoo Lee;
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作者单位

Micro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon;

rnKorea Aerospace University, 100, Hanggongdae Gil, Hwajeon-Dong, Deogyang-Gu, Goyang-city, Gyeonggi-Do;

rnMicro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon;

rnMicro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon;

rnMicro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon yoonkiii@kitech.re.kr;

rnMicro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon;

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原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
lead-free solder; high temperature reliability; joint properties; automotive; thermal cycle;

机译：无铅焊料;高温可靠性;接头性能;汽车;热循环;

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1. Lead-free soldering for automotive applications - meeting the reliability requirement [J] . Viktor Tiedeile, Joerg Mahrle Global SMT & Packaging: European Edition (Surface Mount Technology) . 2005,第9期

机译：汽车应用的无铅焊接-满足可靠性要求
2. Evaluation of lead-free soldering for automotive applications. [J] . Alexandrine Guedon, Eric Woirgard, Christian Zardini Microelectronics & Reliability . 2002,第9a11期

机译：评估汽车应用中的无铅焊接。
3. Evaluation of lead-free soldering for automotive applications [J] . Alexandrine Guedon, Eric Woirgard, Christian Zardini Microelectronics & Reliability . 2002,第9a11期

机译：评估汽车应用中的无铅焊接
4. Reliability evaluation of lead-free solders for automotive applications [C] . Y. K. Sa, Yeong K. Kim, Junghwan Bang, International Symposium on Microelectronics . 2009

机译：用于汽车应用的无铅焊料的可靠性评估
5. Electromigration and thermomigration reliability of lead-free solder joints for advanced packaging applications. [D] . Chae, Seung-Hyun. 2010

机译：用于高级封装应用的无铅焊点的电迁移和热迁移可靠性。
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Preparation of Lead-free Composite Powder Solder Paste and Study on Reliability of Lead-free Solder Joint [O] . 王建 2012

机译：无铅复合粉末焊锡膏的制备及无铅焊点可靠性研究

Reliability evaluation of lead-free solders for automotive applications

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