Development of Ultra-Thin Microelectronic Multi-chip Assemblies

著录项

• 来源
  《42nd international symposium on microelectronics (IMAPS 2009)》|2009年|p.593-600|共8页
• 会议地点 San Jose CA(US);San Jose CA(US)
• 作者

  H.K. Charles Jr.; A.S. Francomacaro; S.J. Lehtonen; A.C. Keeney; G.V. Clatterbaugh; C.V. Banda;

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• 作者单位

  The Johns Hopkins UniversityrnApplied Physics Laboratoryrn11100 Johns Hopkins RoadrnLaurel, MD 20723-6099rn(240) 228-8050 harry.charles@jhuapl.edu;

  rnThe Johns Hopkins UniversityrnApplied Physics Laboratoryrn11100 Johns Hopkins RoadrnLaurel, MD 20723-6099rn(240) 228-8050;

  rnThe Johns Hopkins UniversityrnApplied Physics Laboratoryrn11100 Johns Hopkins RoadrnLaurel, MD 20723-6099rn(240) 228-8050;

  rnThe Johns Hopkins UniversityrnApplied Physics Laboratoryrn11100 Johns Hopkins RoadrnLaurel, MD 20723-6099rn(240) 228-8050;

  rnThe Johns Hopkins UniversityrnApplied Physics Laboratoryrn11100 Johns Hopkins RoadrnLaurel, MD 20723-6099rn(240) 228-8050;

  rnThe Johns Hopkins UniversityrnApplied Physics Laboratoryrn11100 Johns Hopkins RoadrnLaurel, MD 20723-6099rn(240) 228-8050;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 微电子学、集成电路（IC）;
• 关键词

  Ultra-thin substrates; flexible substrate; thin-film multilayer substrates; ultra-thin assemblies; advanced microelectronic packaging; ultra-thin packaging;

  机译：超薄基板;柔性基板;薄膜多层基板;超薄组件;先进的微电子封装;超薄包装;