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首页> 外文会议>42nd international symposium on microelectronics (IMAPS 2009) >Low Temperature Sintering Nanoparticle Inks for Printed Electronic Devices
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Low Temperature Sintering Nanoparticle Inks for Printed Electronic Devices

机译：印刷电子设备用低温烧结纳米粒子油墨

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摘要

The organic and printed electronics bares a great potential to become an industry of $300B in next 20rnyears. While more and more companies and research institutes around the world are joining into thisrnindustry for a large variety of exciting applications, however, there still lack of extraordinarily successfulrnstores in product commercialization. At NanoMas Technologies, Inc., we have been keeping challengingrnourselves to bring in more materials that would be better suitable for needs in the development andrncommercialization of high performance printed electronics on low cost substrates, such as paper andrnplastics. We have developed a variety of nanoparticle based inks with different electric functionalities.rnThose truly nano-sized materials (mostly less than 5 nm) have low sintering temperatures, and thus canrnbe processed on most widely used plastic substrates. In this presentation, we also demonstrated usingrnprinting technologies to fabricate various patterns as well as OTFTs using conjugated polymers andrnnanomaterials. Sintering behaviors from metal nanoparticles to conductive metallic films have beenrnfurther investigated. In addition, we have tested the stretching of printed silver nanoparticle films onrnPET, and found the films electrically conductive up to 120% elongation.
机译：有机和印刷电子产品具有巨大的潜力，在未来20年内成为$ 300B的产业。尽管世界各地越来越多的公司和研究机构正在为各种各样令人兴奋的应用程序加入该行业，但是，在产品商业化方面仍然缺乏非常成功的商店。在NanoMas Technologies，Inc.，我们一直在努力挑战自己，以引入更多更适合在低成本基材（例如纸和塑料）上开发和商业化高性能印刷电子产品的材料。我们已经开发了多种具有不同电功能的基于纳米颗粒的油墨。那些真正的纳米级材料（大多数小于5 nm）具有较低的烧结温度，因此可以在最广泛使用的塑料基材上进行加工。在本演示中，我们还演示了使用共印聚合物和纳米材料使用rnnprinting技术制造各种图案以及OTFT。从金属纳米颗粒到导电金属膜的烧结行为已经被进一步研究。另外，我们测试了在rnPET上印刷的银纳米颗粒薄膜的拉伸，发现薄膜导电率高达120％。

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  • 来源
  • 会议地点 San Jose CA(US);San Jose CA(US)
  • 作者

    Zhihao Yang; Zhiyong Xu; Liwei Huang; Howard Wang;

  • 作者单位

    NanoMas Technologies, Inc, 1093 Clark Street, 258-2D-23, Endicott, NY 13760;

    rnNanoMas Technologies, Inc, 1093 Clark Street, 258-2D-23, Endicott, NY 13760;

    rnDepartment of Mechanical Engineering, Center for Advanced MicroelectronicsrnManufacturing, Binghamton University, SUNY, Binghamton, NY 13902;

    rnDepartment of Mechanical Engineering, Center for Advanced MicroelectronicsrnManufacturing, Binghamton University, SUNY, Binghamton, NY 13902;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
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