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首页> 外文会议>42nd international symposium on microelectronics (IMAPS 2009) >A novel green process to manufacture ultra high density packaging substrates
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A novel green process to manufacture ultra high density packaging substrates

机译：制造超高密度包装基材的新型绿色工艺

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Regarding green manufacturing, the production of PCB & IC substrate leaves a lot of issues in wasternmanagement. Not only in production line setting-up but also in routine operation, the management costs ofrnhazardous chemicals and poison wastes in the processes of PCB & IC substrate are huge. In this paper, werndisclose an efficient production process which requires the least kind of chemicals and can recycles most of thernsolvent. Regarding the details, we integrate 3 evolutional processes in manufacturing of packaging substrate:rnmetal lift-off, temporary wafer bonding and spin-on dielectric layer. In a pilot operation, the complete process ofrnpackaging substrates only requires 3 chemicals excluding a photoresist and a dielectric material.rnDespite improving the waste issues; our substrates still have excellent performance. Regarding high densityrnrouting, our substrate can fan out 3-rows flip chip bump array of 105 μm pitch in just one routing layer. It isrnmuch ahead of ITRS roadmap. In addition, thin thickness is another characteristic of our substrates. In a realrncase, the thickness of our 8-layer packaging substrates is just 90 μm. It is much thinner than the conventionalrnpackaging substrates. With the light and thin characteristics, therefore, our substrates can provide a lot of benefitrnfor packaging of electronics.
机译：关于绿色制造，PCB和IC基板的生产在浪费管理方面存在很多问题。不仅在生产线设置中，而且在日常操作中，PCB和IC基板工艺中有害化学物质和有毒废物的管理成本都很高。在本文中，我们公开了一种有效的生产过程，该过程需要最少种类的化学物质，并且可以回收大多数溶剂。关于细节，我们在封装基板的制造中集成了3个演变过程：金属剥离，临时晶圆键合和旋涂电介质层。在试验操作中，包装基板的完整过程仅需要3种化学物质（光致抗蚀剂和介电材料除外）。我们的基材仍然具有出色的性能。关于高密度布线，我们的基板可以在一个布线层中散布105微米间距的3行倒装芯片凸点阵列。它远远超出了ITRS路线图。另外，薄的厚度是我们基板的另一个特征。实际上，我们的8层封装基板的厚度仅为90μm。它比传统的包装基板薄得多。因此，凭借轻薄的特性，我们的基板可为电子产品包装提供很多好处。

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