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首页> 外文会议>42nd international symposium on microelectronics (IMAPS 2009) >High Density Hearing Aid Chip Packaging
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High Density Hearing Aid Chip Packaging

机译：高密度助听器芯片包装

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摘要

There has been enormous worldwide effortrnto increase the volumetric efficiency of electronicrnpackaging. Much of this effort has been driven by therntelecommunications industry that has succeeded inrnreducing cell phone size while simultaneouslyrnincreasing functionality. The hearing aid business hasrnalways had the need to use extremely small electronicrnpackaging because hearing aids pack electronics intornthe ear canal. Today’s hearing aids such as Starkey’srnS-Series product have extensive computing powerrnand run sophisticated hearing algorithms that haverntremendous impact on a patients quality of life. Thernindustry trend is to put more memory, more signalrnprocessing capability and more wireless capabilityrninto hearing aids to increase functionality and tornimprove performance. In order to achieve higherrnperformance, the hearing business has had to developrnand execute 3D packaging well ahead of otherrnindustries. This paper will examine the history ofrnceramic packaging at Starkey. The challenges andrndrivers for each technology step will be addressed.rnVarious issues will be examined including: availablernASIC technologies, impact of chip metallization,rnsolder interconnect temperature hierarchy,rnovercoming routing design limits, use of embeddedrnpassives, mixed wire bonded and flip chip attachedrndie, and materials limitations. The followingrntechnology changes will be examined along withrntheir impact on thick film ceramic device packaging:rnmove from analog to digital devices, benefits realizedrnutilizing flip chip attach, chip stacking, use ofrnconductive epoxy instead of solder, migration tornstacked thick film ceramic interconnect layers usingrnvertical interconnect channels, and the incorporationrnof RF devices.
机译：世界范围内已经进行了巨大的努力来提高电子包装的容积效率。这些努力的大部分是由电信行业推动的，该行业成功地减小了手机的尺寸，同时又增加了功能。助听器行业一直都需要使用非常小的电子包装，因为助听器会将电子产品包装到耳道中。诸如Starkey的rnS系列产品之类的当今助听器具有强大的计算能力，并运行复杂的听力算法，这些算法对患者的生活质量产生了巨大影响。工业趋势是在助听器中增加更多的内存，更多的信号处理能力和更多的无线功能，以增加功能并改善性能。为了获得更高的性能，听力行业必须先于其他行业开发并执行3D封装。本文将研究Starkey陶瓷包装的历史。将解决每个技术步骤的挑战和动因。将检查各种问题，包括：可用的ASIC技术，芯片金属化的影响，焊料互连温度等级，克服的布线设计限制，嵌入式无源器件的使用，混合引线键合和倒装芯片连接的裸芯片以及材料局限性。将研究以下技术变化及其对厚膜陶瓷器件封装的影响：从模拟到数字器件的迁移，利用倒装芯片连接，芯片堆叠，使用导电环氧树脂代替焊料实现的益处，使用垂直互连通道迁移堆叠的厚膜陶瓷互连层，以及射频装置。

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