MODULAR INTEGRATED MEMS TECHNOLOGY FOUNDRY

机译：模块化集成MEMS技术基础

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MultiBond? iMEMS (integrated MEMS) technology is a variant of SOI (silicon-on-insulator) MEMS that incorporates several bonded layers. This innovative MEMS technology is rapidly gaining popularity in realising numerous solutions for micromachined devices. Numerous MEMS applications can be designed using this technology as it enables semi-customized solutions to be fabricated utilizing generic standardized process modules which are compatible with CMOS foundries. This paper will detail the benefits of Multibond? iMEMS technology and present recent product development and their applications in the optical telecommunications and automotive markets. It will also discuss the commercial incentives of utilizing a technology that enables the customer to maximize the capabilities of both state of the art MEMS and IC fabrication techniques.

机译：多债券？ iMEMS（集成MEMS）技术是SOI（绝缘体上硅）MEMS的一种变体，其中包含了多个粘合层。在为微加工设备实现众多解决方案方面，这项创新的MEMS技术迅速得到普及。可以使用该技术设计许多MEMS应用，因为它可以利用与CMOS代工厂兼容的通用标准化工艺模块来制造半定制解决方案。本文将详细介绍Multibond的好处？ iMEMS技术及其当前的产品开发及其在光通信和汽车市场中的应用。它还将讨论利用使客户能够最大限度地利用最新的MEMS和IC制造技术能力的技术的商业动机。

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《8th International conference on commercialization of micro and nano systems (COMS 2003)》|2003年|127-132|共6页
会议地点 Amsterdam(NL);Amsterdam(NL)
作者
Colin Gormley; Alan Brown;
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ANALOG DEVICES 5 Hannahstown Hill, Belfast BT 17 0LT, Northern Ireland E-mail: colin.gormlev@analog.com Tel: +44 28 9057 3746;

rnANALOG DEVICES 5 Hannahstown Hill, Belfast BT 17 0LT, Northern Ireland;

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1. PLANARIZATION TECHNIQUES FOR VERTICALLY INTEGRATED METALLIC MEMS ON SILICON FOUNDRY CIRCUITS [J] . Lee JB., Ahn CH., Allen MG., Journal of Micromechanics and Microengineering . 1997,第2期

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2. A capacitive CMOS-MEMS sensor designed by multi-physics simulation for integrated CMOS-MEMS technology [J] . Toshifumi Konishi, Daisuke Yamane, Takaaki Matsushima, Japanese journal of applied physics . 2014,第4S期

机译：通过多物理场仿真为集成CMOS-MEMS技术设计的电容式CMOS-MEMS传感器
3. Ultrathin TiN Membranes as a Technology Platform for CM OS-Integrated MEMS and BioMEMS Devices [J] . M. Birkholz, K.-E. Ehwald, P. Kulse, Advanced Functional Materials . 2011,第9期

机译：超薄TiN膜作为CM OS集成MEMS和BioMEMS器件的技术平台
4. APPLIED BIOMEMS? TECHNOLOGY PLATFORMS - A FOUNDRY METHODOLOGY FOR REDUCING THE COMMERCIALIZATION PATHWAYFOR BIOMEMS DEVICES [C] . Howard Goldberg, Diane Chang, Arjun Selvakumar, 8th International conference on commercialization of micro and nano systems (COMS 2003) . 2003

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5. Modularly integrated MEMS technology [D] . Eyoum, Marie-Ange Naida 2006

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7. Use of computer-integrated technologies of designing in foundry [O] . Елена Николаевна Сапегина 2012

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