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Thermal Stress Analysis of a Bi-Material Layered Structure

机译：双层结构的热应力分析

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Thermal stress induced by the mismatch of the thermal expansion coefficients between dissimilar materials becomes an important issue in many bi-layered systems, such as composites and micro-electronic devices. It is useful to provide a simple and efficient analytical model, so that the stress level in the layers can be accurately estimated. Basing on the Bernoulli beam theory, a simple but accurate analytical formulation is proposed to evaluate the thermal stresses in a bi-material beam. The analytical results are compared with finite element results. Good agreement demonstrates that the proposed approach is able to provide an efficient way for the calculation of the thermal stresses. It is shown that thermal stresses are linear proportion to the ratio of thermal expansion coefficients between the two materials. Parametric studies reveal that thermal stresses in each layer are decreasing with the increase of thickness, and are increasing with the increase of Young's modulus ratio between the two materials.
机译：在许多双层系统（例如复合材料和微电子设备）中，由异种材料之间的热膨胀系数不匹配引起的热应力成为重要问题。提供一个简单而有效的分析模型是有用的，这样可以准确地估计各层中的应力水平。基于伯努利梁理论，提出了一种简单而精确的分析公式来评估双材料梁中的热应力。将分析结果与有限元结果进行比较。良好的协议表明，所提出的方法能够提供一种有效的方法来计算热应力。结果表明，热应力与两种材料之间的热膨胀系数之比成线性比例。参数研究表明，每层中的热应力随着厚度的增加而减小，并且随着两种材料之间的杨氏模量比的增加而增加。

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