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首页> 外文会议>Advances in Electronic Packaging 2005 pt.A >SYSTEM LEVEL CONSIDERATIONS IN THE INCORPORATION OF A COMPONENT THERMAL MODEL FOR AN AUTOMOTIVE APPLICATION
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SYSTEM LEVEL CONSIDERATIONS IN THE INCORPORATION OF A COMPONENT THERMAL MODEL FOR AN AUTOMOTIVE APPLICATION

机译：包含用于汽车应用的组件热模型的系统级别考虑

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摘要

A detailed evaluation of modeling techniques used to incorporate a complex component level steady-state thermal model of a 32-pin SSOP package in a system level simulation is described. The device is an Application Specific IC designed for the present system, intended for use in a demanding automotive environment. The paper discusses the development of a compact model, used to enable the incorporation into a system level model with reasonable computational detail. The methodology involves a preliminary system level thermal analysis to estimate the ambient conditions in the vicinity of the device, followed by a detailed model of the device analyzed for various boundary conditions. A simplified compact model of the device is developed and validated against the detailed model. The compact model is shown to be accurate in the prediction of peak temperature in the package and boundary condition independent within realistic extremes of the operating environment. The fact that a compact model may not match the more detailed model at all points in the package is scrutinized in the context of correlation of the model to experimental results. The study highlights the significance of board-level conductivity enhancement and thermal vias under the package in reduction of package temperature.
机译：描述了建模技术的详细评估，该建模技术用于在系统级仿真中合并32引脚SSOP封装的复杂组件级稳态热模型。该器件是针对本系统设计的专用IC，旨在用于要求苛刻的汽车环境中。本文讨论了紧凑模型的开发，该模型用于通过合理的计算细节将其合并到系统级模型中。该方法包括初步的系统级热分析，以估计设备附近的环境条件，然后是针对各种边界条件分析的设备的详细模型。开发了设备的简化紧凑模型，并针对详细模型进行了验证。紧凑型模型在预测包装中的峰值温度和边界条件（在实际的操作环境极限内）方面是准确的。在模型与实验结果相关的情况下，研究了紧凑模型可能无法与包装中所有点上的更详细模型匹配的事实。该研究强调了降低封装温度下在封装下提高板级电导率和散热通孔的重要性。

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