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首页> 外文会议>American Society of Mechanical Engineers(ASME) Integrated Nanosystems Conference: Design, Synthesis, and Applications(NANO 2004); 20040922-24; Pasadena,CA(US) >Performance of a Dual Side Substrate Metrology System for Micromachining Lithography
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Performance of a Dual Side Substrate Metrology System for Micromachining Lithography

机译：用于微加工光刻的双面基板计量系统的性能

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摘要

Advances in micromachining (MEMS) applications such as optical components, inertial and pressure sensors, fluidic pumps and radio frequency (RF) devices are driving lithographic requirements for tighter registration, improved pattern resolution and improved process control on both sides of the substrate. Consequently, there is a similar increase in demand for advanced metrology tools capable of measuring the Dual Side Alignment (DSA) performance of the lithography systems. There are a number of requirements for an advanced DSA metrology tool. First, the system should be capable of measuring points over the entire area of the wafer rather than a narrow area near the lithography alignment targets. Secondly, the system should be capable of measuring a variety of different substrate types and thicknesses. Finally, it should be able to measure substrates containing opaque deposited films such as metals. In this paper, the operation and performance of a new DSA metrology tool is discussed. The UltraMet 100 offers DSA registration measurement at greater than 90% of a wafer's surface area, providing a true picture of a lithography tool's alignment performance and registration yield across the wafer. The system architecture is discussed including the use of top and bottom cameras and the pattern recognition system. Experimental data is shown for tool performance in terms of repeatability and reproducibility over time. The requirements for tool accuracy and methods to establish accuracy to a NIST traceable standard are also discussed.
机译：诸如光学组件，惯性和压力传感器，流体泵和射频（RF）器件之类的微加工（MEMS）应用的进步推动了光刻要求，以实现更严格的套准，改进的图案分辨率以及对基板两侧的工艺控制。因此，对能够测量光刻系统的双面对准（DSA）性能的高级计量工具的需求也出现了类似的增长。对于高级DSA度量工具有许多要求。首先，该系统应该能够测量晶圆整个区域上的点，而不是光刻对准目标附近的狭窄区域。其次，该系统应能够测量各种不同的基板类型和厚度。最后，它应该能够测量包含不透明沉积膜（例如金属）的基材。本文讨论了一种新型DSA度量工具的操作和性能。 UltraMet 100在大于90％的晶片表面积上提供DSA对准测量，从而提供了光刻工具的对准性能和整个晶片的对准成品率的真实图片。讨论了系统架构，包括顶部和底部摄像头的使用以及模式识别系统。随时间的可重复性和可再现性显示了工具性能的实验数据。还讨论了对工具精度的要求以及确定达到NIST可追溯标准的精度的方法。

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